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351-10-152-00-004101 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Preci-Dip. Its product description is CONN HEADER VERT 52POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Preci-Dip 351-10-152-00-004101 is a vertical board-to-board header connector featuring 52 positions with a 0.100 inch (2.54 mm) pitch. Designed for through-hole mounting, it utilizes brass contacts with gold plating on both the mating and tail surfaces, each measuring 10.0 µin (0.25 µm). The unit supports a rated current of 3A and a voltage of 150VDC, operating within a temperature range of -55°C to 125°C. Constructed from black PCT insulation with UL94 V-0 flammability rating, it employs a push-pull fastening mechanism.
Verify the complete part number including all suffixes to ensure correct contact plating and pin count specifications. Confirm that the required current rating aligns with the 3A limit per contact. Check for RoHS compliance status if environmental regulations apply to the assembly. Ensure PCB pad layouts match the 2.54mm pitch dimensions for proper through-hole insertion.
Select this component when high pin density is required in a single row format. The vertical orientation suits applications where space above the board is available. Gold plating is preferred for environments requiring corrosion resistance and low contact impedance. Verify that the 150VDC rating meets the system's electrical requirements before integration.
This connector belongs to the Preci-Dip 351 series, which specializes in vertical headers for board-to-board applications. The series offers various position counts while maintaining consistent 2.54mm spacing. It is designed for general-purpose electronic assemblies requiring robust mechanical stability and reliable electrical performance in standard operating conditions.
Compatible substitutes include other 52-position vertical headers with 2.54mm pitch from manufacturers such as Samtec or Molex. Ensure replacement parts match the physical height, contact material, and plating thickness to maintain interface compatibility.
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