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357-031-531-104 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 31POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 357-031-531-104 is a standard card edge connector designed for vertical panel mounting applications. It features a single row with 31 positions and a pitch of 0.156 inches (3.96 mm). The connector accommodates a board thickness of 0.062 inches (1.57 mm) and utilizes wire wrap termination. Contacts are gold-plated copper alloy, rated for 5 A current at 5 GOhms insulation resistance. Operating temperatures range from -40°C to +105°C.
Verify RoHS compliance status through official manufacturer documentation prior to integration. Confirm that the specific suffix denotes the exact physical dimensions and plating thickness required for your assembly. Cross-reference the datasheet to ensure compatibility with your target PCB stack-up and mating card specifications.
Select this component when a single-row, 31-position interface is required with wire wrap termination capabilities. Ensure the application environment stays within the specified -40°C to +105°C temperature range. Verify that the 0.156-inch pitch aligns with your existing board layout constraints and mating connector requirements.
This part belongs to the EDAC 357 series, which provides robust interconnect solutions for harsh environments. The series includes various position counts and row configurations, all sharing consistent mechanical footprints and material properties. This specific model represents a high-density single-row option within that standardized family.
No public confirmed substitute part numbers are available in the provided documentation. Direct replacement requires identical mechanical dimensions, electrical ratings, and termination style verification.
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