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387-026-560-212 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 26POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 387-026-560-212 is a dual-row card edge connector designed for vertical through-hole mounting. It features 26 positions with a 0.156-inch (3.96 mm) contact spacing and accepts board thicknesses between 0.054 and 0.070 inches. The contacts are made of copper alloy with a gold plating finish, utilizing a cantilever design for reliable engagement. The housing is constructed from black thermoplastic polyester, rated for operation between -40°C and +105°C.
Verify the specific flange configuration and termination style against the official datasheet before ordering. Confirm that the target printed circuit board thickness falls within the specified acceptance range to ensure proper mechanical retention. Check for RoHS compliance requirements if operating in regulated environments. Ensure the selected variant matches the required row count and pin density for the application.
Select this component when a dual-row connection is required for higher signal density in a single vertical profile. The 0.156-inch pitch accommodates standard industrial board layouts. Consider the cantilever contact type for ease of insertion and removal during maintenance. Verify that the thermal rating meets the operational environment constraints of the host system.
This part belongs to the EDAC 387 Series, which provides standard card edge connectors with various position counts and termination options. The series is characterized by its robust construction and compatibility with common industry board standards. Variants within the series differ primarily in pin count, row configuration, and flange specifications.
Cross-reference with other EDAC 387 series parts sharing the same 0.156-inch pitch and dual-row layout. Ensure any substitute maintains identical flange dimensions and mounting hole patterns for direct replacement without PCB redesign.
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