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387-078-555-212 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 78POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 387-078-555-212 is a standard card edge connector from the 387 series, designed for through-hole vertical mounting. It features 78 positions with a 3.96 mm pitch and accepts dual-edge cards of unspecified type. The contacts are made of copper alloy with gold plating, rated for 3 A current. The housing is black thermoplastic polyester, supporting board thicknesses between 1.37 mm and 1.78 mm. Operating temperatures range from -40°C to +105°C.
Verify RoHS compliance status and REACH restrictions before procurement. Confirm that the specific manufacturing date code aligns with project requirements. Ensure the supplier provides valid traceability documentation. Check for any regional distribution limitations or export control classifications such as ECCN EAR99. Validate packaging quantities against logistical needs.
Select this component when a high-density 78-position interface is required. The 3.96 mm pitch accommodates standard board layouts. Verify that the target printed circuit board thickness falls within the 1.37 mm to 1.78 mm acceptance range. Ensure the application environment remains within the specified -40°C to +105°C temperature limits. Confirm that vertical mounting orientation fits the mechanical enclosure constraints.
This part belongs to the EDAC 387 series of standard card edge connectors. The series offers various position counts and termination styles. The 387-078 variant specifically addresses applications requiring robust dual-edge connectivity. It utilizes a consistent 3.96 mm pitch across the family for design compatibility.
No public confirmed substitute part numbers are available in the provided documentation.
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