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396-018-540-202 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 18POS 0.125. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 396-018-540-202 is a standard card edge connector from the 396 series, designed for vertical board-to-board connections. It features an 18-position configuration with a 3.175 mm pitch and supports dual-edge contact interfaces. The connector utilizes gold-plated contacts to ensure reliable signal transmission and includes flanges for secure mounting. It is compatible with PCBs having a thickness of 1.57 mm and is finished in black.
Verify the specific ordering suffix to confirm dual-edge versus single-edge configurations, as variations exist within the 396 series. Ensure compatibility with the target PCB thickness of 1.57 mm before integration. Confirm RoHS compliance status through official manufacturer documentation or authorized distributor datasheets to meet regulatory requirements for your specific application environment.
Select this component when a vertical, dual-edge connection is required for 18 signals. The 3.175 mm pitch accommodates standard card edge layouts. Consider the gold plating for environments where oxidation resistance is critical. Verify that the flange design meets the enclosure mounting constraints of the final assembly.
This part belongs to the EDAC 396 series of standard card edge connectors. The series offers various position counts and edge configurations. The 396-018-540-202 specifically denotes the 18-position variant with dual-edge contacts. This series is widely used in applications demanding high reliability and precise alignment between mating boards.
Direct substitutes may include other EDAC 396 series parts with matching 18-position and dual-edge specifications. Cross-reference pin count, pitch, and mounting style to ensure functional equivalence. Consult official cross-reference guides for verified alternative part numbers.
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