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396-040-526-258 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 40POS 0.125. Review the specifications below when checking this part for your BOM.
The EDAC Inc. model 396-040-526-258 is a standard card edge connector designed for dual-edge mating configurations. It features 40 female contact positions with a 0.125-inch (3.18mm) pitch. The contacts are gold-plated over nickel to ensure reliable signal transmission and corrosion resistance. The housing is constructed from black thermoplastic polyester, providing mechanical stability and insulation. This vertical mount connector supports printed circuit boards up to 1.57mm in thickness, facilitating secure board-to-board or backplane connections.
Verify the specific datasheet version against the manufacturer's official documentation before procurement. Confirm that the gold plating specification matches the application requirements. Ensure the PCB thickness tolerance aligns with the connector's design limits. Cross-reference the part number suffixes to confirm exact pin count and edge type compatibility.
Select this component when a high-reliability dual-edge connection is required for thick PCBs. The 0.125-inch pitch offers a balance between density and manufacturability. Consider the vertical form factor for constrained enclosures. Validate that the gold contact finish meets the environmental exposure standards of the target deployment scenario.
This component belongs to the EDAC 396 series of standard card edge connectors. The series provides various position counts and edge configurations. The 396-040-526-258 specifically addresses the need for 40-position dual-edge connectivity. It complements single-edge variants within the same product family for diverse system architectures.
Direct substitutes include other EDAC 396 series parts with identical 40-position dual-edge specifications. Verify pitch and plating equivalence when considering cross-manufacturer alternatives. Ensure mechanical dimensions match the existing footprint constraints.
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