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3FS-328 is listed in the Power Transformers range at ChipApex. The manufacturer field lists Tamura. Its product description is PWR XFMR LAMINATED 2.4VA TH. Review the specifications below when checking this part for your BOM.
The Tamura 3FS-328 is a laminated core power transformer designed for through-hole mounting. It features a single primary winding rated at 115V and dual secondary windings supporting parallel or series configurations. The parallel output provides 14V at 170mA, while the series configuration yields 28V at 85mA. With a maximum power rating of 2.4VA, this component ensures reliable isolation with a voltage rating of 2500Vrms. Its physical dimensions are 35.56mm in length, 31.00mm in width, and a maximum height of 32.10mm.
Verify that the specific order matches the manufacturer part number 3FS-328 to ensure correct electrical specifications. Confirm that the application environment supports the thermal characteristics of a 2.4VA laminated transformer. Ensure PCB layout accommodates the specified through-hole pin spacing and physical envelope dimensions. Check for RoHS compliance requirements if operating in regulated regions.
Select this component when a 115V primary input is required with either 14V or 28V secondary outputs. The choice depends on whether higher current (170mA) or higher voltage (28V) is needed. This transformer is suitable for designs where space constraints fit within the 35.56mm x 31.00mm footprint. Consider the 2.4VA limit to ensure the load does not exceed the rated capacity.
This model belongs to the 3FS-3xx series of flange power transformers manufactured by Tamura. These components are widely used in legacy and modern electronic systems requiring robust isolation. The series offers various voltage combinations, with the 3FS-328 specifically addressing common 14V and 28V secondary needs.
Cross-reference with other Tamura 3FS-3xx series parts for similar form factors. Verify that any substitute maintains the 2500Vrms isolation and 2.4VA power rating. Ensure mechanical compatibility with existing PCB footprints before integration.
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