3SM123GZB1VE-R

Overview

The 3SM123GZB1VE-R is an analog MEMS microphone IC manufactured by Solid State System. It features a capacitive audio sensor integrated with a specialized pre-amplification ASIC to deliver high sensitivity and signal-to-noise ratio. The device operates within a frequency range of 100 Hz to 10 kHz, offering omnidirectional pickup capability. Key electrical specifications include a sensitivity of -38dB ±1dB at 94dB SPL and a typical current consumption of 80uA. The component is housed in a miniature LGA 4-pin package measuring 2.75mm x 1.85mm x 0.90mm, designed for surface mount technology.

Feature Summary

• Integrated pre-amplification ASIC for high sensitivity and SNR output
• Bottom port design suitable for automatic pick-and-place handling
• High stability with no risk of membrane aging
• RoHS and green compliant construction

Applications

• Headsets
• Wearable devices
• Telecommunication electronics

Procurement Notes

Verify the specific suffix (VE-R) against official datasheets to confirm analog output type and packaging details. Ensure compatibility with SMT reflow profiles up to 260°C for 30 seconds during assembly. Confirm that the application circuit supports the required bias voltage and impedance matching for the analog interface. Cross-reference pin definitions with the manufacturer's latest documentation to prevent integration errors.

Selection Notes

Select this component for applications requiring compact form factors and low power consumption. The miniature dimensions facilitate integration into space-constrained wearable and headset designs. The analog output interface requires appropriate ADC or amplifier stages in the system architecture. Consider the thermal endurance limits when designing the PCB layout for high-temperature manufacturing processes.

Part Context

Solid State System specializes in MEMS microphone solutions and NAND flash technologies. This part belongs to their series of integrated microphone ICs designed for consumer electronics. The company emphasizes reliability and miniaturization in its product line, targeting markets such as mobile communications and personal audio devices where size and performance are critical constraints.

Replacement Considerations

Check for direct substitutes within the 3SM123 family, such as the 3SM123GZB1VD, ensuring functional equivalence in sensitivity and package dimensions. Verify that any replacement maintains the same analog output characteristics and pinout configuration to avoid redesigning the host circuit board.