4050BDM

Overview

The 4050BDM is a hex buffer integrated circuit manufactured by National Semiconductor. It features six independent buffers within a single package, designed for signal amplification and stabilization in digital logic applications. The device utilizes ECL/TTL compatible technology and is housed in a 40-pin ceramic dual in-line package (DIP). It operates with a nominal supply voltage of 5 V and supports through-hole mounting. The component is rated for military temperature grades, functioning reliably between -55 °C and 125 °C.

Feature Summary

• Provides six independent buffer channels for digital signal processing
• Compatible with ECL and TTL logic families for versatile interface integration
• Constructed in a robust ceramic DIP package suitable for harsh environments

Applications

• Military-grade digital logic systems requiring high reliability
• Signal buffering and isolation in aerospace control units
• Industrial control interfaces utilizing ECL/TTL standards

Procurement Notes

Verify the specific datasheet version and revision history to ensure compatibility with current design requirements. Confirm that the ceramic packaging and military temperature rating align with environmental specifications. Check for any specific screening levels or quality certifications required by the end application. Ensure the 5V supply voltage matches the system power architecture before integration.

Selection Notes

Select this component when a hex buffer configuration is required for ECL or TTL logic interfacing. The ceramic DIP package makes it suitable for applications demanding high thermal stability and mechanical durability. Consider the 5V operating voltage and military temperature range when evaluating system constraints. This part is appropriate for legacy or specialized systems where standard plastic packages are insufficient.

Part Context

National Semiconductor, now part of Texas Instruments, produced the 4050 series as a family of hex buffers. The 4050BDM variant specifically denotes the buffered output version in a military-grade ceramic package. This series was widely used in digital electronics for driving loads and isolating stages. The BDM suffix indicates the specific package type and material composition distinct from other variants in the product line.

Replacement Considerations

Cross-reference with CD4050BCN for commercial grade alternatives if military specifications are not required. Verify pinout compatibility before substituting with other hex buffer ICs. Ensure the replacement supports the same ECL/TTL input/output characteristics and voltage levels.