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The 4164-15FGS/BZA is a dynamic random-access memory (DRAM) integrated circuit manufactured by Rochester Electronics, LLC. It belongs to the 4164 series of memory components. The device features a dual-marked designation indicating specific manufacturing or quality tracking identifiers. It is designed for surface-mount applications and operates within standard industrial temperature ranges. The component utilizes a lead-free and RoHS compliant construction process, ensuring environmental safety standards are met. Its primary function involves data storage and retrieval in electronic systems requiring volatile memory solutions.
Verify the authenticity of the dual-marked identifier on the component surface against official Rochester Electronics documentation. Confirm that the package type matches the required board layout specifications. Ensure the lead-free status aligns with your assembly process requirements. Check for any specific handling instructions related to electrostatic discharge sensitivity during installation and storage procedures.
Select this component when a reliable source for legacy or specialized DRAM technology is required. Consider its surface-mount form factor for compact design constraints. Evaluate the need for volatile memory characteristics versus non-volatile alternatives. Ensure compatibility with existing system voltage levels and timing requirements before integration into the final product design.
Rochester Electronics specializes in sustaining production of mature semiconductor technologies that may no longer be actively marketed by original equipment manufacturers. This company maintains inventory and manufacturing capabilities for a wide range of logic, memory, and discrete components. The 4164-15FGS/BZA represents their effort to provide continued availability for critical memory parts through licensed reproduction or stock management strategies.
Direct pin-to-pin replacements should be verified against original manufacturer datasheets for the base 4164 series. Functional equivalents from other vendors must match the memory density and access times. Ensure that any substitute component supports the same surface-mount package dimensions and thermal characteristics.