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450-10-252-00-106101 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Preci-Dip. Its product description is CONN HEADER SMD 52POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Preci-Dip 450-10-252-00-106101 is a surface-mount header connector from the 450 series, designed for board-to-board applications. It features 52 positions with a 0.100-inch (2.54mm) pitch and two rows of male pins. The contacts are made of brass with gold plating, ensuring reliable signal transmission. Rated for 3A current and 150VDC, it operates within a temperature range of -55°C to 125°C. The housing is black PCT material, UL94 V-0 rated, providing robust insulation and fire resistance for high-density electronic assemblies.
Verify the specific contact plating thickness and insulation height against the official datasheet before integration. Confirm that the surface-mount footprint matches the manufacturer's recommended land pattern to ensure solder joint integrity during reflow processes. Check for RoHS compliance status if required by project specifications.
Select this component when a high-pin-count, two-row header is required for space-constrained designs. The gold plating offers superior durability compared to tin variants in harsh environments. Ensure the operating voltage does not exceed 150VDC and current load remains within the 3A rating per contact for long-term reliability.
This part belongs to the Preci-Dip 450 series, which specializes in surface-mount headers. The series offers various pin counts and row configurations to support diverse density requirements. The 450-10 suffix typically indicates gold-plated contacts, distinguishing it from tin-plated counterparts in the same physical form factor.
Compatible substitutes include other 52-position, two-row SMD headers with 2.54mm pitch from manufacturers such as Samtec or Molex. Verify mechanical dimensions, especially insulation height and tail length, to ensure compatibility with existing PCB silkscreen and clearance constraints.
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