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The Oupiin 4973-22TSB is a 4.20mm pitch wire-to-board connector wafer belonging to the 4973 Series. It features a straight (STR) configuration designed for surface mount or through-hole PCB integration. The component utilizes a thermoplastic polyester housing compliant with UL 94V-0 and UL 94V-2 flammability standards. It supports wire gauges ranging from 16AWG to 28AWG, with a current rating between 6A and 9A depending on pin count. The design incorporates snap-in alignment posts for secure PCB retention and a locking mechanism to ensure reliable mating connections.
Verify that the specific suffix 'TSB' corresponds to the Straight Wafer configuration as documented in official Oupiin catalogs. Confirm that the required wire gauge falls within the 16–28AWG range specified for this series. Ensure the application environment is compatible with the UL 94V-0/V-2 rated thermoplastic polyester material. Cross-reference the pin count against the 6–9A current rating limits defined by the manufacturer.
Select this component when a 4.20mm pitch straight wafer is required for robust PCB retention. The integrated snap-in posts distinguish it from standard wafers requiring separate alignment hardware. Consider the 16–28AWG wire compatibility for diverse harness applications. Verify that the straight orientation fits the spatial constraints of the target assembly compared to right-angle alternatives.
This part belongs to the Oupiin 4973 Series, which covers 4.20mm pitch wire-to-board connectors. The series includes male/female housings and various wafer configurations. The 4973-22TSB specifically denotes a 2-position straight wafer variant. It shares the series' core features, including dual contact designs and industry-standard dimensions, tailored for high-reliability connections.
No public confirmed substitute part numbers are available in the provided documentation. Users must verify mechanical fit and electrical ratings if considering alternative manufacturers. Direct replacement requires matching the 4.20mm pitch and straight wafer form factor.