4DIR1420HAXUMA1

Overview

The Infineon Technologies 4DIR1420HAXUMA1 is a four-channel SPI digital isolator utilizing magnetic coupling technology. It provides 5700Vrms isolation voltage and supports data rates up to 40Mbps with a common-mode transient immunity of 100kV/µs. The device operates within a supply voltage range of 2.7V to 6.5V and features unidirectional channel configurations (3 inputs on side 1, 1 input on side 2). It is housed in a 16-SOIC package with a width of 7.50mm and is qualified for automotive applications under AEC-Q100 standards.

Feature Summary

• Provides reinforced electrical isolation via magnetic coupling technology for signal integrity
• Supports high-speed serial peripheral interface communication with low propagation delay
• Engineered for robust performance in high electromagnetic interference environments

Applications

• Electric vehicle traction inverters
• Battery management systems
• High-voltage industrial control interfaces

Procurement Notes

Verify component authenticity through authorized distribution channels due to end-of-life status. Confirm that the specific package variant matches design requirements. Check for updated lifecycle notifications from the manufacturer regarding final shipment dates. Ensure compatibility with existing PCB footprints before procurement.

Selection Notes

Select this component when high isolation voltage and fast SPI communication are required in space-constrained designs. The unidirectional channel arrangement suits specific control logic flows. Consider thermal management capabilities within the SOIC package for continuous operation.

Part Context

This part belongs to the ISOFACE family of digital isolators designed for automotive and industrial markets. It replaces older generations by offering improved speed and reliability. The device integrates multiple isolated channels into a single compact footprint to reduce board space.

Replacement Considerations

The 4DIR1400HAXUMA1 is listed as a parameter-equivalent substitute. Verify pinout and specification alignment before integration.