51101

51101

  • Description:SBC 3 CORE 2GB RAM
  • Series:-

SKU:f0342a4f9b0d Category: Brand:

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Product Detailed Parameters

  • Description:SBC 3 CORE 2GB RAM
  • Series:-
  • Mfr:congatec
  • Package:Box
  • Architecture:MPU
  • Core Processor:ARM® Cortex®-A53, ARM® Cortex®-M4F
  • Flash Size:16GB
  • RAM Size:2GB
  • Peripherals:LVDS
  • Connectivity:CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPI, UART, USB
  • Speed:1.2GHz, 264MHz
  • Primary Attributes:-
  • Operating Temperature:0°C ~ 60°C
  • Grade:-
  • Qualification:-
  • Package / Case:Module
  • Supplier Device Package:-

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51101

Overview

The CONGA-SA8/C3-N355-16G-EMMC64 is a SMARC 2.1 computer-on-module manufactured by congatec, identified by part number 051416. It integrates an Intel Core 3 N355 processor with a base frequency of 1.9 GHz and turbo boost up to 3.9 GHz. The module features 16 GB of 4800 MT/s LPDDR5 memory and 64 GB of eMMC 5.1 onboard flash storage. Operating within a commercial temperature range of 0°C to +60°C, it measures 82 mm x 50 mm.

Feature Summary

  • Supports Intel Core 3 N355 eight-core architecture for high-performance edge computing tasks
  • Provides high-speed data transfer via integrated LPDDR5 memory and eMMC storage interfaces
  • Designed for compact integration using the standard SMARC 2.2 form factor specification

Applications

  • Industrial automation control systems
  • Medical technology devices
  • Robotics platforms

Procurement Notes

Verify the exact part number against official congatec documentation before procurement. Confirm that the required thermal solution aligns with the specified commercial temperature range of 0°C to +60°C. Ensure compatibility with the host carrier board regarding the SMARC 2.2 interface specifications. Cross-reference the manufacturer identifier to avoid confusion with similar models in the product portfolio.

Selection Notes

Select this module when an eight-core Intel processor is required within a compact SMARC footprint. Consider the 16 GB LPDDR5 capacity for applications demanding significant memory bandwidth. Evaluate the commercial temperature range suitability against the specific environmental conditions of the deployment site. Verify interface requirements for I2C, PCIe, SCI, SPI, UART, and USB connectivity.

Part Context

This component belongs to the congatec COM product line, which provides embedded computing solutions. The company specializes in hardware and software building blocks for industrial and medical sectors. The module utilizes the SMARC specification, enabling standardized integration into various carrier boards designed for edge computing and IoT applications.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult official congatec documentation for potential alternatives or updated model revisions.

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