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512CCA000230BAG is listed in the Pin ConfigurableSelectable Oscillators range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is XTAL OSC XO 3.3V 6SMD. Review the specifications below when checking this part for your BOM.
The Skyworks Solutions Inc. 512CCA000230BAG is a standard clock oscillator (XO) from the Si512 series, designed for dual-frequency output applications. It provides two selectable frequencies: 22.5792 MHz and 24.576 MHz. The device operates on a single supply voltage ranging from 1.71 V to 1.89 V, with a nominal operating voltage of 1.8 V. It features CMOS output format and maintains a frequency stability of 30 PPM. The component supports an enable pin configuration and functions within a temperature range of -40°C to +85°C. It is housed in a compact 5 mm x 3.2 mm surface-mount package.
Verify the specific ordering suffix and package variant against the manufacturer's latest datasheet to ensure compatibility with the intended application requirements. Confirm that the dual-frequency selection matches the system design specifications before procurement. Check for any recent product change notifications regarding manufacturing sites or material composition updates.
Select this component when a dual-frequency clock source is required within a low-voltage environment. Ensure the load capacitance requirements align with the connected circuitry, as the device typically interfaces with a 15 pF load. Verify that the operating temperature range meets the environmental conditions of the final assembly.
This part belongs to the Si512 family of silicon oscillators, which are known for their flexibility and low jitter performance. The 512CCA000230BAG specifically addresses applications needing multiple clock frequencies from a single package, reducing board space and component count compared to using separate single-frequency oscillators.
The 512KCA000230AAGR is a documented parametric equivalent offering similar dual-frequency capabilities. When substituting, verify that the package dimensions and pinout configurations are compatible with the existing footprint.
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