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5400FB15B0100001R is listed in the Balun range at ChipApex. The manufacturer field lists Johanson Technology Inc.. Its product description is IC. Review the specifications below when checking this part for your BOM.
The Johanson Technology Inc. 5400FB15B0100001R is an RF balun designed for the 5.4 GHz frequency band, specifically targeting Wi-Fi applications. It operates within a frequency range of 4.9 GHz to 5.875 GHz and provides a 1:2 impedance transformation ratio. The component features a 50 Ohm single-ended input and two 100 Ohm differential outputs. Packaged in a compact 0603 (1608 metric) surface-mount footprint, it supports operation from -40°C to +85°C. This integrated passive device combines balancing functionality with filtering capabilities to optimize signal integrity in wireless communication systems.
Verify the specific suffix 'R' against the manufacturer's official datasheet to confirm tape-and-reel packaging specifications. Ensure the part number matches the exact electrical parameters required for your 5.4 GHz design. Cross-reference the RoHS compliance status and moisture sensitivity level with current regulatory requirements before finalizing procurement orders.
Select this component when a compact solution is needed for 5.4 GHz Wi-Fi designs requiring simultaneous balancing and filtering. The 0603 package size suits space-constrained PCB layouts. Confirm that the 1:2 impedance ratio aligns with the source and load impedances of the connected RF components to ensure optimal power transfer and minimal reflection.
This balun belongs to Johanson Technology's integrated passive device portfolio, which consolidates multiple discrete RF components into single packages. Such integration reduces board space and improves performance consistency compared to discrete solutions. The 5400 series is engineered for high-volume consumer electronics manufacturing, offering reliable performance in demanding wireless environments.
Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with alternative baluns by matching the center frequency, bandwidth, impedance ratios, and physical package dimensions to ensure seamless integration without redesigning the circuit layout.
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