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The SN54F174/B2A is a hex positive-edge-triggered D-type flip-flop manufactured by Rochester Electronics. It features six independent D-type flip-flops with complementary outputs and asynchronous preset and clear inputs. The device utilizes the F/FAST logic series for high-speed performance. It is housed in a ceramic chip carrier package (CQCC20) designed for military and aerospace environments. Key electrical parameters include a propagation delay of 10.5 ns, an operating temperature range from -55 °C to 125 °C, and TTL-compatible inputs. The component supports full binary decoding data selection and is qualified under MIL-PRF-38535 standards.
Verify that the specific ordering suffix matches the required package variant and quality level. Confirm that the component meets the applicable MIL-PRF-38535 class requirements for your project. Ensure compatibility with existing board layouts regarding the ceramic chip carrier footprint. Check for any specific burn-in or screening requirements mandated by your system specifications before finalizing procurement orders.
Select this component when six independent D-type flip-flops are required in a single package. Consider the F/FAST series characteristics for applications needing faster switching speeds compared to standard logic families. Evaluate the ceramic package options if hermetic sealing is necessary for environmental protection. Compare against other hex flip-flops based on propagation delay and input/output compatibility requirements.
This part belongs to the SN54F174 family of hex D-type flip-flops produced by Rochester Electronics. The manufacturer specializes in providing replacement components for legacy and end-of-life integrated circuits. These parts are often used to maintain supply chains for critical infrastructure where original equipment manufacturer support is no longer available. The B2A suffix indicates specific packaging and testing configurations.
Direct substitutes include other SN54F174 variants with compatible pinouts and electrical specifications. Verify that alternative sources meet the same MIL-PRF-38535 qualification levels. Ensure that any replacement maintains the same propagation delay and power consumption characteristics. Cross-reference package dimensions to confirm mechanical fit within the existing assembly.