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The 54F257/BFA is a high-speed CMOS quad multiplexer manufactured by Rochester Electronics. It features four independent 2-line to 1-line data selectors with true outputs and three-state control. The device operates within a supply voltage range of 2V to 6V, ensuring compatibility with standard logic families. It utilizes a ceramic flatpack package with 16 pins, designed for robust performance in demanding environments. Key electrical characteristics include a maximum propagation delay of 7 nanoseconds and a load capacitance of 50 picofarads. The component supports an operating temperature range from -55°C to 125°C, making it suitable for industrial and military applications requiring reliable signal routing.
Verify the specific suffix 'BFA' against manufacturer documentation to confirm package type and material specifications. Ensure compliance with current export control regulations and RoHS directives if applicable. Confirm that the ceramic flatpack form factor matches your PCB footprint requirements. Validate lot traceability and quality certifications prior to final procurement decisions.
Select this component when high-speed signal multiplexing is required in harsh thermal environments. The ceramic package offers superior thermal stability compared to plastic alternatives. Verify that the 2V to 6V supply range aligns with your system power rails. Consider the 7ns propagation delay for timing-critical designs. Ensure board space accommodates the 16-pin flatpack dimensions.
This part belongs to the 54F/FAST series of high-speed logic devices. Rochester Electronics specializes in sourcing and distributing obsolete and hard-to-find semiconductors. The 54F series is known for its speed-performance trade-off between standard TTL and advanced CMOS technologies. This specific variant maintains the functional integrity of the original Fairchild Semiconductor design.
Direct replacements include the 54F257AFM or other 54F257 variants from different manufacturers. Verify pinout compatibility and electrical parameters before substitution. Ceramic packages may require specific handling procedures during assembly.