54FCT245TLB

Overview

The 54FCT245TLB is a military-grade octal bidirectional bus transceiver manufactured by Renesas Electronics Corporation. It utilizes FCT/PCT-CMOS technology and is housed in a 20-pin plastic DIP package. The device supports an 8-bit data width with three-state outputs and operates within a temperature range of -55°C to +125°C. It functions as a single transceiver element designed for asynchronous two-way communication between data buses, controlled by a transmit/receive input that determines the direction of data flow.

Feature Summary

• Military-grade reliability with extended operating temperature range
• Octal bidirectional data transfer capability
• Three-state output configuration

Applications

• Asynchronous two-way communication between data buses
• Military electronic systems requiring high-temperature stability
• Industrial control interfaces demanding robust signal integrity

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific suffix 'TLB' corresponds to the intended military-grade specification and package variant. Ensure compliance with RoHS exemptions if applicable, as indicated by historical non-compliant status for similar legacy parts. Validate datasheet revisions to ensure alignment with current design requirements.

Selection Notes

Select this component when military-grade environmental tolerance is required alongside standard FCT logic performance. The wide temperature range makes it suitable for harsh environments where commercial grade devices would fail. Consider the DIP package constraints for prototyping or specific board layout needs compared to surface mount alternatives.

Part Context

This part belongs to the 54-series logic family, which denotes military qualification standards. It is functionally related to the commercial 74FCT245 series but offers enhanced durability and temperature specifications. The device serves as a critical interface component in systems requiring reliable data transmission across varying thermal conditions.