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552AD000591DGR is listed in the Pin ConfigurableSelectable Oscillators range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is XTAL OSC VCXO 3.3V 6SMD. Review the specifications below when checking this part for your BOM.
The Skyworks Solutions Inc. 552AD000591DGR is a dual-frequency Voltage-Controlled Crystal Oscillator (VCXO) belonging to the Si552 series. It operates within a frequency range of 10 MHz to 1.4 GHz and utilizes an LVPECL output format. The device functions on a nominal 3.3 V supply voltage, with acceptable operating limits between 2.97 V and 3.63 V. It features a maximum current rating of 130 mA and supports a load capacitance of 15 pF. The component is housed in a 7 mm x 5 mm surface-mount package with a height of 1.8 mm. It is designed for operation across a temperature range of -40°C to +85°C.
Verify that the specific part number matches the required dual-frequency configuration and LVPECL output format. Confirm that the supply voltage requirements align with the 3.3 V nominal specification. Ensure the operating temperature range meets the environmental conditions of the target application. Check for any specific ordering suffixes that might affect packaging or availability status.
Select this component when a dual-frequency VCXO with LVPECL outputs is required. Consider the 7 mm x 5 mm package dimensions for board space constraints. Evaluate the 130 mA current consumption against power budget limitations. Verify compatibility with the intended load capacitance of 15 pF. Ensure the frequency range covers all necessary operational points.
This oscillator is part of the Si552 family from Skyworks Solutions Inc., which specializes in precision timing solutions. The series offers various output formats and frequency options to suit different system requirements. The 552AD000591DGR specifically addresses needs for dual-frequency generation in compact surface-mount packages.
The 552AD000591DG is a listed equivalent variant. Verify if the tape-and-reel versus cut-tape packaging difference impacts the manufacturing process.
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