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The Broadcom Limited 5962-0824201HYC is a high-speed optocoupler featuring a single channel with a data rate of 10 MBd. It utilizes a photo IC output type and supports a forward current of 20 mA with a forward voltage of 1.55 V. The device provides electrical isolation of 1500 VDC and offers a common-mode transient immunity of 1 kV/µs. This component is hermetically sealed and designed for robust signal transmission in demanding electronic applications.
Verify the specific suffix HYC to confirm the surface-mount package variant, as the base part number may correspond to different packaging options. Ensure compatibility with existing board layouts by checking the SMD footprint dimensions against the official datasheet. Confirm that the hermetic seal requirement aligns with the application's environmental standards before finalizing procurement orders.
Select this component when high-speed digital isolation is critical for system performance. The 10 MBd data rate suits applications requiring rapid signal switching between isolated domains. Consider the 1500 VDC isolation rating for safety compliance in high-voltage environments. The Schottky-clamped output enhances switching speed and reduces storage time compared to standard logic outputs.
This device belongs to the Broadcom 5962-0 series of high-speed optocouplers. The series is characterized by advanced semiconductor technology enabling fast response times and reliable operation. The 5962-0824201HYC specifically addresses needs for compact, high-performance isolation solutions in modern electronic designs where signal integrity and speed are paramount.
Cross-reference with other 5962-series variants from Broadcom or compatible manufacturers offering similar 10 MBd rates and 1500 VDC isolation. Verify pinout compatibility and package dimensions to ensure direct replacement feasibility without PCB redesign.
The 5962-0824201HYC features a common-mode transient immunity of 1 kV/µs, ensuring reliable operation in noisy environments.
The HYC suffix indicates an 8-SMD (Surface Mount Device) butt joint package configuration.