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The 5962-8956806UA is a CMOS First-In-First-Out (FIFO) memory device manufactured by Renesas Electronics Corporation. It features a 4K x 9 bit organization, providing non-volatile data buffering capabilities for parallel data interfaces. The component operates within an industrial temperature range of -55°C to +125°C and utilizes a ceramic dual in-line package (CDIP) with 28 leads. This part belongs to the 5962-89568 series and is designated as a military-grade or high-reliability variant suitable for harsh environments.
Verify the specific suffix 'UA' against official Renesas documentation to confirm exact pinout and electrical characteristics, as variations exist within the 5962-89568 series. Confirm current availability status, as many components in this legacy series may be subject to discontinuation notices. Ensure compliance with relevant military specifications such as MIL-STD-883 if required for your application. Request lot traceability and certification documents upon order placement.
Select this component when a parallel FIFO interface is required for robust data handling in extreme temperature conditions. The CMOS technology offers advantages in power efficiency compared to older bipolar implementations. Consider the CDIP package constraints regarding PCB space and mounting requirements. Evaluate system timing requirements against the specific access time specifications provided in the datasheet to ensure compatibility with the host processor bus speed.
This part belongs to the 5962-89568 family of CMOS FIFOs produced by Renesas Electronics. These devices are designed for applications demanding high reliability and performance in demanding environments. The family typically includes various configurations differing in data width and depth, all sharing similar core architecture and interface standards. They serve as critical memory buffers in complex digital systems where data integrity and timing precision are paramount.
Direct replacements must match the 4Kx9 bit capacity, CMOS technology, and CDIP-28 package. Verify that any substitute component meets the same -55°C to +125°C operating temperature range and adheres to equivalent military qualification standards. Check for pin-to-pin compatibility to avoid redesigning the printed circuit board layout.