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5962-8978501YA is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is OPTOISO 1.5KV 2CH DARL 8-DIP BJ. Review the specifications below when checking this part for your BOM.
The Broadcom Limited 5962-8978501YA is a dual-channel logic output optocoupler housed in an 8-pin PDIP package. It operates with a supply voltage range of 4.5V to 20V DC and provides 1500VDC isolation. The device features open collector outputs capable of handling up to 40mA continuous current, with a typical current transfer ratio of 1500%. Designed for hermetically sealed environments, it supports operation from -55°C to +125°C.
Verify the specific suffix 'YA' against official Broadcom datasheets to confirm pinout and electrical characteristics match your design requirements. Ensure procurement channels provide traceable documentation for military-grade components. Confirm hermetic seal integrity if required by your application standards. Cross-reference the Mouser number 630-5962-8978501YA for accurate part identification during ordering.
Select this component when high isolation voltage and wide temperature tolerance are critical. The dual-channel design reduces board space compared to single-channel alternatives. Verify that the open collector output type aligns with your downstream logic interface requirements. Consider the hermetic packaging benefits for long-term reliability in demanding environments over standard plastic packages.
This part belongs to the 5962-8978 series of logic output optocouplers manufactured by Broadcom Limited. The series includes various channel configurations and output types, all sharing hermetically sealed packaging. These devices are designed for high-reliability applications where standard commercial components may fail due to environmental stress or radiation exposure.
Direct replacements include other parts within the 5962-8978 series such as 5962-8978501PA or 5962-8978501ZA, provided pinouts and electrical specs match. Verify compatibility with existing PCB footprints and thermal management strategies before substitution.
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