SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Broadcom Limited 5962-9085501HPA is a high-speed optocoupler featuring a single channel with hermetically sealed packaging in an 8-pin PDIP format. It operates at a data rate of 10 MBd and provides isolation voltage of 1500 VDC. The device utilizes an open collector output type, supporting a forward current of 20 mA and an output current of 25 mA. Key timing parameters include a rise time of 90 ns and a fall time of 40 ns. The component functions within a temperature range of -55°C to 125°C, with a power dissipation rating of 200 mW.
Verify the specific suffix (HPA) against official Broadcom documentation to confirm package style and material specifications. Ensure that procurement channels provide valid manufacturer traceability records. Cross-reference the datasheet revision date to confirm compatibility with current design requirements. Confirm that the hermetic seal integrity meets aerospace or military standards if applicable. Validate that the open collector output configuration aligns with the target circuit load requirements.
Select this component when high-speed digital isolation is required alongside robust noise rejection capabilities. The Schottky-clamped input offers faster switching compared to standard logic outputs. Consider the hermetic package for applications exposed to harsh environments or strict reliability standards. Evaluate the 1500 VDC isolation barrier against system safety regulations. Ensure the open collector output can interface correctly with the downstream logic family voltage levels.
This part belongs to Broadcom's high-speed optocoupler portfolio, designed for demanding industrial and communication applications. The 5962 prefix indicates a military-grade or high-reliability variant often sourced through government contracts. It complements lower-speed isolators by providing MHz-range data transmission speeds while maintaining electrical safety barriers.
Direct substitutes must match the 10 MBd speed, 1500 VDC isolation, and hermetic PDIP-8 package. Verify equivalent common-mode transient immunity ratings. Check for identical pinout configurations to ensure board-level compatibility without redesign.