5962-9085501KPA

Overview

The Broadcom Limited 5962-9085501KPA is a high-speed optocoupler featuring a logic output with an open collector and Schottky clamped configuration. It provides one channel of isolation with a data rate of 10MBd and a common-mode transient immunity of 1kV/µs. The device operates within a hermetically sealed 8-DIP package, ensuring reliable performance in demanding environments while maintaining electrical isolation.

Feature Summary

• Hermetically sealed construction for enhanced environmental reliability
• Schottky-clamped logic output design for improved switching speed
• High common-mode transient immunity supporting noisy signal transmission

Applications

• Industrial control systems requiring galvanic isolation
• Data communication interfaces needing high-speed signal transfer
• Military and aerospace electronic circuits

Procurement Notes

Verify the specific ordering suffix to confirm the exact package type and temperature range specifications. Ensure compatibility with existing PCB footprints for the 8-DIP configuration. Cross-reference the datasheet for absolute maximum ratings to prevent operational stress during integration into final assemblies.

Selection Notes

Select this component when high-speed digital isolation is required alongside robust noise immunity. The Schottky clamp feature makes it suitable for applications where rapid signal transitions are critical. Consider the hermetic seal requirement if the operating environment involves harsh conditions or strict reliability standards.

Part Context

This part belongs to the broader family of high-speed optocouplers manufactured by Broadcom Limited. It shares functional similarities with other models in the series but is distinguished by its specific logic output structure and hermetic packaging. The designation indicates compliance with military-grade quality standards typical of the 5962 series.

Replacement Considerations

Direct substitutes include the 5962-9085501HPA from the same manufacturer line. Verify pinout compatibility and electrical parameters before swapping components in existing designs to ensure circuit integrity.