5962-9099703MRA

Overview

The Altera 5962-9099703MRA is a microprocessor circuit component manufactured using CMOS technology. It features a bus interface and is housed in a 20-pin Ceramic Dual In-Line Package (CDIP) with a 0.300-inch (7.62mm) footprint. This device belongs to the Interface series and is designed for high-reliability applications requiring robust signal processing capabilities within embedded systems.

Feature Summary

• CMOS-based microprocessor circuit architecture
• Bus interface connectivity
• 20-pin CDIP mechanical housing

Applications

• Embedded system control units
• Industrial interface modules
• High-reliability computing hardware

Procurement Notes

Verify the specific revision level and manufacturing date code against project requirements. Confirm that the 20-CDIP package dimensions align with existing board footprints. Ensure compatibility with the target bus protocol before integration. Request official datasheets to validate electrical characteristics for the intended operating environment.

Selection Notes

Select this component when a ruggedized, leaded ceramic package is required for harsh environments. The CMOS technology offers standard logic levels suitable for legacy or specialized bus architectures. Consider thermal management guidelines for CDIP packages during PCB layout to ensure long-term reliability and stable operation under load.

Part Context

This part falls within Altera's broader portfolio of programmable logic and interface solutions. While many modern Altera devices utilize BGA or QFP packages, this specific part represents a specialized interface circuit in a traditional dual-in-line form factor, catering to niche applications requiring through-hole mounting or specific mechanical constraints.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Verify pinout and voltage compatibility if considering alternative vendors for similar bus interface functions.