5962-9172601MLA

Overview

The Texas Instruments 5962-9172601MLA is a specialty function logic scan test device featuring octal buffers. It is housed in a 24-pin Ceramic Dual In-Line Package (CDIP). The component operates within an extended industrial temperature range of -55°C to 125°C. This integrated circuit is designed for specialized digital signal testing and verification applications requiring high reliability and robust buffer capabilities.

Feature Summary

• Integrated octal buffer configuration for signal scanning
• Extended temperature operation capability
• Ceramic dual in-line package construction

Applications

• Digital signal processor testing
• Specialty logic verification
• Industrial control system diagnostics

Procurement Notes

Verify the specific datasheet revision and manufacturer documentation before integration, as military-grade components may have strict handling requirements. Confirm that the 24-CDIP package dimensions match your PCB footprint exactly. Ensure thermal management strategies accommodate the specified operating temperature range during final assembly validation.

Selection Notes

Select this component when dedicated scan test functionality with octal buffering is required for high-reliability environments. The ceramic package offers superior durability compared to plastic alternatives. Consider the extended temperature range suitability for harsh industrial or aerospace conditions where standard commercial grade parts are insufficient.

Part Context

This part belongs to Texas Instruments' specialty function logic family, specifically designed for scan test devices. It complements other TI logic products by providing dedicated buffer solutions for complex digital testing architectures. The 5962 prefix indicates it is a military-grade or high-reliability variant subject to specific qualification standards.

Replacement Considerations

Consult official Texas Instruments substitution guides for verified equivalents. Cross-reference pinouts and electrical characteristics carefully when considering alternative vendors. Ensure any substitute maintains compatibility with the 24-CDIP form factor and specified temperature ratings.