5962-9224203MSA

Overview

The IDT 5962-9224203MSA is an octal bus transceiver featuring non-inverting logic with three-state outputs. It operates within a voltage range of 4.5V to 5.5V and supports temperatures from -55°C to 125°C. The device utilizes a 20-pin CERPACK package, providing robust signal transmission for high-reliability applications requiring TTL compatibility and low leakage characteristics.

Feature Summary

• Non-inverting octal bus transceiver architecture
• Three-state output capability for bus line management
• True TTL input and output compatibility
• Low input and output leakage current specifications

Applications

• High-reliability military and aerospace systems
• Industrial control bus interfaces
• Data acquisition systems requiring wide temperature operation
• Memory buffer applications in harsh environments

Procurement Notes

Verify the specific grade (Std, A, or C) required for your application, as performance metrics may vary between grades. Confirm that the 20-pin CERPACK package aligns with your board layout constraints. Ensure the 4.5V to 5.5V supply voltage matches your system design. Check for lead-free status requirements if applicable to your manufacturing standards.

Selection Notes

Select this component when a non-inverting octal transceiver with three-state outputs is needed for MIL-STD environments. It is suitable for designs requiring TTL compatibility and operation across extreme temperatures. Consider the CERPACK package size for space-constrained PCB layouts. Verify leakage current limits against your specific noise immunity requirements.

Part Context

This part belongs to the IDT (now Renesas) family of high-reliability CMOS logic devices. It is designed for demanding applications where standard commercial parts may fail due to environmental stress. The 5962 prefix indicates a military-grade qualification standard, ensuring consistent performance under rigorous conditions.

Replacement Considerations

Direct substitutes include other 5962-qualified octal bus transceivers with similar pinouts and electrical characteristics. Verify compatibility with existing board footprints and thermal management solutions. Ensure replacement parts meet the same temperature and voltage specifications.