5962F2320401VXC

5962F2320401VXC

  • Description:RADIATION-HARDNESS-ASSURED (RHA)
  • Series:-

SKU:3f8386709162 Category: Brand:

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Product Detailed Parameters

  • Description:RADIATION-HARDNESS-ASSURED (RHA)
  • Series:-
  • Mfr:Texas Instruments
  • Package:Tray
  • Number of Bits:18
  • Sampling Rate (Per Second):65M
  • Number of Inputs:2, 4
  • Input Type:Differential, Single Ended
  • Data Interface:LVDS - Serial, SPI
  • Configuration:ADC
  • Ratio - S/H:ADC:0:02
  • Number of A/D Converters:2
  • Architecture:SAR
  • Reference Type:External, Internal
  • Voltage - Supply, Analog:1.75V ~ 1.85V
  • Voltage - Supply, Digital:1.75V ~ 1.85V
  • Features:-
  • Operating Temperature:-55°C ~ 105°C
  • Package / Case:64-CFlatPack
  • Supplier Device Package:64-CFP
  • Mounting Type:Surface Mount
  • Grade:-
  • Qualification:-

Download product information

5962F2320401VXC

Overview

The Texas Instruments ADC3683-SP is a radiation-hardness-assured, dual-channel, 18-bit analog-to-digital converter (ADC) supporting sampling rates from 1 to 65 MSPS. It features low latency, low noise with a spectral density of -160 dBFS/Hz, and ultra-low power consumption of 84 mW/ch at 65 MSPS. The device includes an optional digital down converter (DDC) with decimation factors of 2, 4, 8, 16, and 32, and utilizes a serial LVDS interface. It operates within an ambient temperature range of -55°C to 105°C and is housed in a 64-pin Ceramic Flat Pack (HBP) package.

Feature Summary

  • Radiation hardness assured with QML-V screening, 300krad TID tolerance, and SEL immunity up to 75 MeV-cm2/mg
  • Integrated digital down converter (DDC) supporting real or complex decimation by 2, 4, 8, 16, and 32
  • Low latency architecture providing 1 clock cycle delay in 1-wire mode and 2 clock cycles in 2-wire mode
  • Serial LVDS (SLVDS) interface available in 2-, 1-, and 1/2-wire configurations to minimize digital interconnects

Applications

  • Optical imaging payload
  • Radar imaging payload
  • Satellite communication payloads

Procurement Notes

Verify the specific ordering suffix and grade requirements for your mission profile. Confirm that the QML-V screening and radiation performance metrics align with your system's environmental constraints. Ensure compatibility with the 64-pin CFP package dimensions and thermal management requirements before finalizing procurement specifications.

Selection Notes

Select this component when high-speed, high-resolution data acquisition is required in radiation-intensive environments. Consider the integrated DDC if reducing downstream data rates and system power consumption is a priority. Evaluate the SLVDS interface options based on trace count limitations and signal integrity requirements in your PCB layout.

Part Context

This part belongs to the ADC3683-SP family of radiation-hardened SAR ADCs. It is pin-to-pin compatible with other devices in the series, such as the ADC3664-SP, facilitating design flexibility across different resolution and speed requirements within the same platform.

Replacement Considerations

Public confirmed substitute part numbers are not provided in the source material.

5962F2320401VXC5962F2320401VXC

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