5AGTMC3D3F27I3G

Overview

The Altera 5AGTMC3D3F27I3G is an Arria V GT Field Programmable Gate Array featuring 181,165 Logic Elements and 71,698 Adaptive Logic Modules. It integrates 8.26 Mbit of embedded memory and supports a core voltage of 1.15 V. The device includes 16 transceivers with data rates up to 6.554 Gb/s. It utilizes a 1517-pin FineLine Ball-Grid Array package and operates within a commercial temperature range of 0°C to +100°C.

Feature Summary

• Integrates high-speed serial transceivers for multi-gigabit connectivity
• Provides extensive programmable logic resources via Adaptive Logic Modules
• Includes substantial on-chip memory blocks for data buffering

Applications

• High-performance networking infrastructure equipment
• Industrial automation control systems
• Test and measurement instrumentation

Procurement Notes

Verify the specific ordering suffix against official manufacturer documentation to confirm package type and temperature grade. Ensure compliance with export regulations as this component may require additional authorization for international shipment. Confirm RoHS status through the latest datasheet before procurement.

Selection Notes

Select this model when the design requires approximately 180k logic elements and multiple high-speed serial interfaces. Compare resource availability against larger Arria V variants if higher capacity is needed. Verify that the 1517-pin FBGA footprint matches the target PCB layout constraints.

Part Context

This part belongs to the Arria V GT family, designed for cost-sensitive applications requiring moderate performance. It sits below the Arria V GX series in terms of transceiver capabilities but offers significant logic density compared to Cyclone devices. It represents a mature product line within the Altera portfolio.

Replacement Considerations

Direct substitutes include other Arria V GT devices with similar logic counts, such as the 5AGTFC3 or 5AGTED3 series. Cross-family migration to Agilex or Stratix requires significant redesign. Verify pin compatibility and thermal requirements before considering alternative packages.