5AGXFB1H4F40C4G

Overview

The Altera 5AGXFB1H4F40C4G is an Arria V GX Field Programmable Gate Array (FPGA) featuring 300,000 logic elements and 14,151 LAB/CLBs. It provides 704 I/Os within a 1517-BBGA package. The device includes 17,358,848 total RAM bits and supports data rates up to 6.5536 Gb/s. Operating voltage ranges from 1.07V to 1.13V, with a junction temperature range of -40°C to 100°C.

Feature Summary

• High-density logic architecture with significant embedded memory capacity for complex digital processing tasks
• Integrated high-speed transceivers supporting multi-gigabit serial communication protocols
• Robust thermal performance suitable for demanding industrial operating environments

Applications

• High-performance networking infrastructure equipment
• Industrial automation control systems
• Test and measurement instrumentation

Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to ensure correct pinout and electrical characteristics. Confirm moisture sensitivity level handling requirements prior to assembly. Cross-reference the part number with authorized distributors to validate authenticity and current production status.

Selection Notes

Evaluate the device's logic density and memory resources against system complexity requirements. Assess the availability of sufficient I/O pins and transceiver lanes for interface connectivity. Consider thermal management solutions given the power dissipation profile and operating temperature constraints of the FCBGA package.

Part Context

This component belongs to the Arria V GX family, designed for cost-sensitive applications requiring high bandwidth and low power consumption. It integrates ARM-based hard processor systems and shared memory controllers, offering a balanced solution for mixed-signal and digital signal processing workloads in compact form factors.

Replacement Considerations

Direct substitutes include other variants within the Arria V GX series such as 5AGXFB1H4F40I5G, provided pin compatibility and feature sets align with design specifications. Verify that alternative packages maintain identical footprint dimensions for board reuse.