5CEFA2M13C7N

Overview

The Altera 5CEFA2M13C7N is a Cyclone V E series Field Programmable Gate Array (FPGA) manufactured by Intel. It features 25,000 Logic Elements and 9,434 Adaptive Logic Modules within a 383-ball MBGA package measuring 13x13 mm. The device provides 223 user I/Os and includes 2,002,944 total bits of embedded memory. It operates at a supply voltage range of 1.07V to 1.13V and supports a junction temperature range of 0°C to 85°C.

Feature Summary

• Integrates ARM Cortex-A9 hard processor system for heterogeneous computing capabilities
• Utilizes 28nm technology for optimized power consumption and performance
• Supports high-speed serial transceivers for complex interface protocols

Applications

• Industrial automation control systems
• Medical imaging equipment signal processing
• Telecommunications infrastructure components

Procurement Notes

Verify the specific suffix C7N against official datasheets to confirm speed grade and commercial temperature range compatibility. Ensure the ordering part number matches the exact logic density and package dimensions required for your PCB layout. Cross-reference with Intel's current product availability status before finalizing procurement plans.

Selection Notes

Compare this model against other Cyclone V E variants based on required Logic Element counts and memory capacity. Verify that the 383-ball MBGA package fits within your board space constraints. Confirm that the 223 I/O count meets your interface requirements without necessitating additional level shifters or multiplexers.

Part Context

This component belongs to the Cyclone V E family, which targets cost-sensitive applications requiring moderate performance. It sits below higher-density Stratix and Arria families while offering more advanced features than the basic Cyclone IV series. The E designation indicates an economy-focused variant optimized for volume production.

Replacement Considerations

Direct substitutes include other 5CEFA2 series parts with different suffixes indicating varied speed grades or packaging options. Verify pin-to-pin compatibility when considering alternative packages within the same logic density tier.