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Product Detailed Parameters
- Description:IC FPGA 360 I/O 780HBGA
- Series:Stratix® V GS
- Mfr:Altera
- Package:Tray
- Number of LABs/CLBs:89000
- Number of Logic Elements/Cells:236000
- Total RAM Bits:13312000
- Number of I/O:360
- Voltage - Supply:0.82V ~ 0.88V
- Mounting Type:Surface Mount
- Operating Temperature:0°C ~ 85°C (TJ)
- Package / Case:780-BBGA, FCBGA
- Supplier Device Package:780-HBGA (33x33)
- Number of Gates:-
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Overview
The Altera 5SGSMD3E3H29C4WN is a Stratix V GS Field Programmable Gate Array (FPGA) designed for high-performance digital logic applications. It features 236,000 Logic Elements (LEs), 89,000 Adaptive Logic Modules (ALMs), and 13 Mbit of embedded memory. The device supports up to 360 I/O pins and operates within a junction temperature range of -40°C to 100°C. Packaged in a 780-pin FineLine BGA (HBGA-780), it utilizes the Quartus Prime design software for configuration and development.
Feature Summary
- High-density programmable logic with 236,000 LEs and 89,000 ALMs
- Integrated 13 Mbit embedded memory for data storage and processing
- Supports up to 360 general-purpose I/O connections
- Extended industrial operating temperature range up to 100°C
Applications
- Complex digital signal processing systems
- Industrial automation and control logic
- Telecommunications infrastructure equipment
- Test and measurement instrumentation
Procurement Notes
Verify the specific suffix 'C4WN' against official Intel/Altera documentation, as standard listings often use 'C4G'. Confirm RoHS compliance status and moisture sensitivity level (MSL 3) requirements for your assembly process. Ensure compatibility with the required PCB footprint and thermal management solutions for the 780-pin HBGA package.
Selection Notes
Select this component when a balance of moderate logic density and extended temperature range is required. Compare against the 5SGSMD4 series if higher logic capacity (360,000 LEs) is needed. Verify that the 13 Mbit embedded memory meets system buffering requirements without external RAM dependencies.
Part Context
This part belongs to the Stratix V GS family, which targets cost-sensitive yet robust applications compared to the standard Stratix V line. The 'GS' designation typically indicates a grade optimized for specific performance or thermal characteristics. It shares the same 780-pin HBGA package form factor as other variants in the 5SGSMD3E series.
Replacement Considerations
Direct pin-to-pin replacements are limited within the same package. Consider the 5SGSMD3E3H29C4G for similar specifications if the 'WN' suffix denotes a specific regional or packaging variant. For upgraded logic density, the 5SGSMD4E series offers higher LE counts but requires re-evaluation of power and thermal constraints.
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