5SGSMD3E3H29I4WN

5SGSMD3E3H29I4WN

  • Description:IC FPGA 360 I/O 780HBGA
  • Series:Stratix® V GS

SKU:edd7c7eea43f Category: Brand:

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Product Detailed Parameters

  • Description:IC FPGA 360 I/O 780HBGA
  • Series:Stratix® V GS
  • Mfr:Altera
  • Package:Tray
  • Number of LABs/CLBs:89000
  • Number of Logic Elements/Cells:236000
  • Total RAM Bits:13312000
  • Number of I/O:360
  • Voltage - Supply:0.82V ~ 0.88V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:780-BBGA, FCBGA
  • Supplier Device Package:780-HBGA (33x33)
  • Number of Gates:-

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5SGSMD3E3H29I4WN

Overview

The Altera 5SGSMD3E3H29I4G is a Stratix V GS Field Programmable Gate Array (FPGA) designed for high-performance digital logic applications. It features 236,000 Logic Elements (LEs), 89,000 Adaptive Logic Modules (ALMs), and 13 Mbit of embedded memory. The device operates within a junction temperature range of -40°C to 100°C and supports 360 I/O pins. It is housed in a 780-BBGA/FCBGA package with a supply voltage range of 0.82V to 0.88V.

Feature Summary

  • High-density programmable logic architecture with over 236,000 LEs
  • Integrated high-speed transceivers and embedded memory blocks
  • Supports complex digital signal processing and system-level integration

Applications

  • Telecommunications infrastructure equipment
  • Industrial automation and control systems
  • Test and measurement instrumentation
  • Medical imaging systems

Procurement Notes

Verify the exact suffix against official manufacturer documentation, as standard listings typically use suffixes like I4G or C4G rather than WN. Confirm moisture sensitivity level (MSL 3) and shelf-life requirements prior to assembly. Ensure compatibility with Quartus Prime software versions supporting the Stratix V GS family for programming and configuration.

Selection Notes

Select this component when designing systems requiring significant logic density and low-power operation. Compare total available logic resources and memory bandwidth against application demands. Verify that the 780-ball BGA package footprint fits the PCB layout constraints and thermal management strategy.

Part Context

This part belongs to the Stratix V GS series, which targets cost-sensitive applications while maintaining high performance. It shares architectural similarities with other Stratix V devices but offers optimized power consumption. The 5SGSMD3E prefix indicates specific die and package combinations within the broader Stratix portfolio.

Replacement Considerations

Direct replacements include other Stratix V GS variants such as 5SGSMD3E3H29C4G or 5SGSMD3E3H29I3LG, provided pinout and electrical specifications match. Cross-family migration to Agilex or Stratix 10 requires significant design re-verification due to architectural differences.

5SGSMD3E3H29I4WN5SGSMD3E3H29I4WN

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