— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC FPGA 432 I/O 1152FBGA
- Series:Stratix® V GS
- Mfr:Altera
- Package:Tray
- Number of LABs/CLBs:89000
- Number of Logic Elements/Cells:236000
- Total RAM Bits:13312000
- Number of I/O:432
- Voltage - Supply:0.82V ~ 0.88V
- Mounting Type:Surface Mount
- Operating Temperature:0°C ~ 85°C (TJ)
- Package / Case:1152-BBGA, FCBGA
- Supplier Device Package:1152-FBGA (35x35)
- Number of Gates:-
Download product information
Overview
The Altera 5SGSMD3H2F35C2L is a Stratix V GS Field Programmable Gate Array featuring 236,000 logic elements and 89,000 adaptive logic modules. It integrates 13 Mbit of embedded memory with 432 I/Os housed in an FBGA-1152 package. The device supports data rates up to 14.1 Gb/s via 24 transceivers. Operating voltage is fixed at 850 mV, with a commercial temperature range of 0°C to +70°C.
Feature Summary
- Stratix V GS architecture optimized for power efficiency
- High-speed serial connectivity through integrated transceivers
- Large-scale programmable logic fabric for complex designs
Applications
- Telecommunications infrastructure equipment
- Industrial automation control systems
- Medical imaging signal processing
- Test and measurement instrumentation
Procurement Notes
This component is officially listed as obsolete by the manufacturer. Availability is restricted to existing stock or secondary market sources. Verification of part authenticity and physical condition is critical due to end-of-life status. Moisture sensitivity requires strict handling protocols during storage and assembly to prevent damage.
Selection Notes
Engineers should evaluate current design requirements against this legacy platform before committing to procurement. Consider the availability of development tools and long-term support implications. Alternative newer generation FPGAs may offer improved performance and supply chain stability for new production runs.
Part Context
Part of the Stratix V GS family, designed for high-performance applications requiring significant logic density and low power consumption. This specific variant targets commercial temperature environments and utilizes the 1152-ball FBGA form factor for surface mount integration.
ChipApex | Global Electronic Components Supplier







