5SGSMD3H2F35I3LN

Overview

The Altera 5SGSMD3H2F35I3LN is a Stratix V GS Field Programmable Gate Array featuring 236,000 logic elements and 89,000 adaptive logic modules. It integrates 13 Mbit of embedded memory with 432 I/Os. The device supports data rates up to 14.1 Gb/s via 24 transceivers. Operating voltage is fixed at 900 mV, with an operating temperature range from -40°C to +85°C. It is housed in a 1152-pin FBGA package.

Feature Summary

• Stratix V GS architecture optimized for high-density logic applications
• Integrated high-speed serial transceivers supporting 14.1 Gb/s data rates
• Significant embedded memory capacity for complex data processing tasks
• Robust thermal performance suitable for industrial environments

Applications

• High-performance telecommunications infrastructure equipment
• Industrial automation and control systems requiring deterministic logic
• Medical imaging systems demanding high throughput and low latency
• Test and measurement instrumentation with complex signal processing needs

Procurement Notes

Verify component authenticity through authorized channels due to potential availability constraints. Confirm RoHS compliance status and moisture sensitivity level prior to assembly planning. Check for specific manufacturing date codes if long-term supply stability is required. Ensure packaging integrity matches storage requirements for sensitive devices.

Selection Notes

Select this model when high logic density and substantial embedded memory are required within the Stratix V family. Compare against other GS variants based on specific I/O count and transceiver requirements. Consider power consumption profiles relative to system cooling capabilities. Evaluate pin compatibility if replacing existing designs using similar FBGA footprints.

Part Context

This component belongs to the Intel (formerly Altera) Stratix V GS series, designed for cost-sensitive, high-volume applications requiring significant programmable logic. The GS variant typically offers a balance between performance and resource utilization compared to higher-end GX or GT families. It utilizes advanced process technology to deliver high transistor counts in a compact form factor.

Replacement Considerations

Direct functional substitutes within the same package and specification set may be limited due to product lifecycle status. Verify pin-to-pin compatibility with newer Intel FPGA families if upgrading. Ensure software toolchain support for legacy devices remains available. Consult official documentation for recommended migration paths to current generation architectures.