5SGSMD3H3F35C2LN

Overview

The Altera 5SGSMD3H3F35C2LN is a Stratix V GS Field Programmable Gate Array featuring 236,000 logic elements and 89,000 adaptive logic modules. It integrates 13 Mbit of embedded memory and supports 432 I/Os within an FCBGA-1152 package. The device operates at a core voltage of 0.85V with data rates up to 14.1 Gb/s across 24 transceivers. It functions within a junction temperature range of 0°C to +70°C and carries Moisture Sensitivity Level 3.

Feature Summary

• High-density programmable logic architecture with extensive embedded memory resources
• Integrated high-speed serial transceivers supporting multi-gigabit data transmission
• Robust thermal and electrical performance for demanding industrial environments

Applications

• High-performance telecommunications infrastructure equipment
• Complex industrial control systems requiring deterministic logic processing
• Medical imaging hardware utilizing advanced signal processing capabilities
• Automotive electronics systems needing reliable real-time computation

Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm exact operational characteristics. Confirm moisture sensitivity handling requirements prior to assembly. Ensure compatibility with current design tools and verify that the component meets all relevant regulatory standards for the intended deployment region before finalizing procurement plans.

Selection Notes

Select this component when high logic density and moderate I/O counts are required in a compact form factor. Consider the Stratix V GS series for applications balancing performance with power efficiency. Evaluate the available embedded memory against algorithmic storage needs. Assess the thermal management solution to ensure operation remains within the specified junction temperature limits during peak load conditions.

Part Context

This part belongs to the Stratix V GS family, designed for cost-sensitive yet high-performance applications. It shares architectural similarities with other devices in the series but offers distinct resource configurations. The FCBGA-1152 package provides robust mechanical stability and efficient heat dissipation pathways suitable for dense board layouts.

Replacement Considerations

Publicly confirmed direct substitutes are not identified in the provided source material. Engineering teams should consult official replacement guides or contact the manufacturer directly to identify compatible upgrades or cross-reference alternatives with matching pinouts and functional specifications.