5SGSMD4E2H29I3N

5SGSMD4E2H29I3N

  • Description:IC FPGA 360 I/O 780HBGA
  • Series:Stratix® V GS

SKU:3d08954433f7 Category: Brand:

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Product Detailed Parameters

  • Description:IC FPGA 360 I/O 780HBGA
  • Series:Stratix® V GS
  • Mfr:Altera
  • Package:Tray
  • Number of LABs/CLBs:135840
  • Number of Logic Elements/Cells:360000
  • Total RAM Bits:19456000
  • Number of I/O:360
  • Voltage - Supply:0.82V ~ 0.88V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:780-BBGA, FCBGA
  • Supplier Device Package:780-HBGA (33x33)
  • Number of Gates:-

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5SGSMD4E2H29I3N

Overview

The Altera 5SGSMD4E2H29I3N is a Stratix V GS Field Programmable Gate Array (FPGA) designed for high-density applications. It features 360,000 logic elements and 135,840 Adaptive Logic Modules (ALMs). The device integrates 19 Mbit of embedded memory and supports up to 360 I/O pins. It operates within a junction temperature range of -40°C to 100°C and utilizes a 780-ball HBGA package. Core supply voltage ranges from 0.82V to 0.88V.

Feature Summary

  • High-density programmable logic fabric with significant embedded memory capacity
  • Supports extensive I/O configurations for complex system interconnectivity
  • Operates reliably across extended industrial temperature ranges

Applications

  • High-performance telecommunications infrastructure equipment
  • Advanced data center networking and switching systems
  • Industrial automation and control processing units
  • Test and measurement instrumentation platforms

Procurement Notes

Verify the specific suffix 'I3N' against official Altera documentation to confirm pinout and electrical characteristics, as variations exist within the Stratix V GS family. Confirm RoHS compliance status and moisture sensitivity level requirements prior to assembly. Ensure compatibility with Quartus Prime software versions supporting this device generation. Check for any pending product change notices affecting manufacturing or labeling.

Selection Notes

Select this component when high logic density and substantial on-chip memory are required for complex signal processing tasks. Compare performance metrics against lower-density Stratix variants if cost or power constraints are critical. Evaluate thermal management solutions suitable for the 780-ball BGA package. Ensure design tools support the specific speed grade associated with the 'I3' designation.

Part Context

This part belongs to the Stratix V GS family, which targets general-purpose high-density applications. It sits alongside other devices like the 5SGSMD4E2H29I3LG and 5SGSMD4E2H29I2LG in terms of logical capacity but differs in package or speed grading. The family emphasizes power efficiency relative to performance for demanding digital designs.

Replacement Considerations

Direct substitutes within the same package and functionality must be verified through official cross-reference lists. Devices such as 5SGSMD4E2H29I3LG share similar logical resources but may differ in speed grades or pin assignments. Always validate mechanical footprint and electrical specifications before substituting.

5SGSMD4E2H29I3N5SGSMD4E2H29I3N

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