— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC FPGA 432 I/O 1152FBGA
- Series:Stratix® V GS
- Mfr:Altera
- Package:Tray
- Number of LABs/CLBs:135840
- Number of Logic Elements/Cells:360000
- Total RAM Bits:19456000
- Number of I/O:432
- Voltage - Supply:0.87V ~ 0.93V
- Mounting Type:Surface Mount
- Operating Temperature:-40°C ~ 100°C (TJ)
- Package / Case:1152-BBGA, FCBGA
- Supplier Device Package:1152-FBGA (35x35)
- Number of Gates:-
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Overview
The Altera 5SGSMD4H1F35I2N is a Stratix V GS Field Programmable Gate Array featuring 360,000 logic elements and 135,840 adaptive logic modules. It integrates 19 Mbit of embedded memory and supports up to 432 I/Os. The device includes 24 transceivers capable of 14.1 Gb/s data rates. Operating voltage is fixed at 900 mV, with an operating temperature range from -40°C to +85°C.
Feature Summary
- Stratix V GS architecture optimized for cost-sensitive high-performance applications
- Integrated 24 high-speed serial transceivers supporting 14.1 Gb/s signaling
- High-density programmable logic with significant embedded memory capacity
Applications
- Telecommunications infrastructure equipment
- Industrial automation control systems
- Test and measurement instrumentation
Procurement Notes
This component is listed as obsolete or end-of-life by the manufacturer. Availability is restricted to surplus markets or existing inventory. Verification of part authenticity and physical condition is critical due to the discontinued status. Ensure compatibility with legacy design files before procurement.
Selection Notes
Select this model when requiring Stratix V GS performance within the FBGA-1152 package. Compare against other 5SGSD4 variants based on specific logic element counts and speed grades. Verify that the 900 mV core voltage and thermal requirements align with the target system design constraints.
Part Context
Part of the Intel (formerly Altera) Stratix V family, specifically the GS (General Speed) series designed for balanced performance and cost. This generation utilizes advanced process technology to deliver high logic density and serial connectivity in a compact form factor suitable for dense PCB layouts.
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