5SGSMD5H3F35I3NYY

5SGSMD5H3F35I3NYY

  • Description:IC FPGA 552 I/O 1152FBGA
  • Series:Stratix® V GS

SKU:ca484112dfba Category: Brand:

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Product Detailed Parameters

  • Description:IC FPGA 552 I/O 1152FBGA
  • Series:Stratix® V GS
  • Mfr:Altera
  • Package:Tray
  • Number of LABs/CLBs:172600
  • Number of Logic Elements/Cells:457000
  • Total RAM Bits:39936000
  • Number of I/O:552
  • Voltage - Supply:0.82V ~ 0.88V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1152-BBGA, FCBGA
  • Supplier Device Package:1152-FBGA (35x35)
  • Number of Gates:-

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5SGSMD5H3F35I3NYY

Overview

The Altera 5SGSMD5H3F35I3NYY is a Stratix V GS Field Programmable Gate Array (FPGA) IC featuring 457,000 logic elements and 172,600 Adaptive Logic Modules. It includes 39 Mbit of embedded memory and supports 552 I/Os within a 1152-ball FCBGA package. The device operates at a supply voltage of 0.82V to 0.88V and supports data rates up to 14.1 Gb/s with 24 transceivers. It functions within a junction temperature range of -40°C to 100°C.

Feature Summary

  • Integrates high-density programmable logic with significant embedded memory capacity for complex digital processing tasks.
  • Equipped with multiple high-speed serial transceivers supporting advanced communication protocols.
  • Designed for surface-mount installation in compact electronic assemblies requiring robust signal integrity.

Applications

  • High-performance telecommunications infrastructure equipment
  • Industrial automation and control systems
  • Data center networking and storage solutions

Procurement Notes

Verify the specific suffix codes against official Intel/Altera documentation to ensure correct speed grade and temperature rating. Confirm moisture sensitivity level requirements and reflow soldering profiles prior to assembly. Check current product status as some variants may be discontinued or subject to long lead times.

Selection Notes

Evaluate the total logic element count and memory bandwidth against target algorithm complexity. Ensure the 1152-ball package footprint matches the PCB design constraints. Verify that the thermal management solution accommodates the power dissipation characteristics of the Stratix V GS series under full load conditions.

Part Context

This component belongs to the Stratix V GS family, targeting cost-sensitive applications requiring substantial logic resources. It represents a mid-range option within the broader Stratix portfolio, balancing performance with manufacturing efficiency for mass production environments.

Replacement Considerations

Direct substitutes include other Stratix V GS variants such as 5SGSMD5H2F35C3N or 5SGSMD5H2F35I3G, provided pin compatibility and electrical specifications align with the original design requirements.

5SGSMD5H3F35I3NYY5SGSMD5H3F35I3NYY

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