— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC FPGA 696 I/O 1517FBGA
- Series:Stratix® V GS
- Mfr:Altera
- Package:Tray
- Number of LABs/CLBs:262400
- Number of Logic Elements/Cells:695000
- Total RAM Bits:51200000
- Number of I/O:696
- Voltage - Supply:0.82V ~ 0.88V
- Mounting Type:Surface Mount
- Operating Temperature:0°C ~ 85°C (TJ)
- Package / Case:1517-BBGA, FCBGA
- Supplier Device Package:1517-FBGA (40x40)
- Number of Gates:-
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Overview
The Altera 5SGSMD8K2F40C3N is a Stratix V GS Field Programmable Gate Array featuring 695,000 logic elements and 262,400 Adaptive Logic Modules. It integrates 51.2 Mbits of embedded memory and supports up to 696 I/Os. The device operates within a junction temperature range of 0°C to 70°C and utilizes a 1517-ball FCBGA package.
Feature Summary
- High-density programmable logic architecture with extensive embedded memory resources
- Supports high-speed serial data transmission via integrated transceivers
- Designed for complex digital signal processing and system integration tasks
Applications
- Telecommunications infrastructure equipment
- Industrial automation control systems
- Medical imaging hardware platforms
- Test and measurement instrumentation
Procurement Notes
Verify the specific suffix 'N' against official manufacturer documentation to confirm environmental compliance or regional designation details. Confirm current product lifecycle status as some sources indicate discontinuation. Ensure compatibility with required design tools and verify package specifications before procurement.
Selection Notes
Select this component for applications requiring high logic density and significant embedded memory within a compact form factor. Compare performance metrics against other Stratix V variants based on specific I/O count and power consumption requirements. Validate thermal management solutions for the specified operating temperature range.
Part Context
This part belongs to the Stratix V GS family, targeting cost-sensitive high-performance applications. It shares the same physical footprint and pinout with other devices in the series, allowing for potential design flexibility within the same package constraints while offering distinct resource configurations.
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