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Product Detailed Parameters
- Description:IC FPGA 432 I/O 1152FBGA
- Series:Stratix® V GX
- Mfr:Altera
- Package:Tray
- Number of LABs/CLBs:128300
- Number of Logic Elements/Cells:340000
- Total RAM Bits:19456000
- Number of I/O:432
- Voltage - Supply:0.82V ~ 0.88V
- Mounting Type:Surface Mount
- Operating Temperature:-40°C ~ 100°C (TJ)
- Package / Case:1152-BBGA, FCBGA
- Supplier Device Package:1152-FBGA (35x35)
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Overview
The Altera 5SGXEA3H3F35I3LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC. It features 432 I/Os and utilizes a 1152-BBGA, FCBGA package. The device contains 340,000 logic elements/cells and 128,300 LABs/CLBs. Total RAM bits amount to 19,456,000. Supply voltage ranges from 0.82V to 0.88V. Operating temperature spans -40°C to 100°C (TJ).
Feature Summary
- Stratix V GX series FPGA architecture with high-density programmable logic.
- Integrated embedded memory resources for data storage and processing.
- Surface mount mounting type suitable for automated assembly processes.
Applications
- High-performance digital signal processing systems.
- Complex logic control applications requiring reconfigurable hardware.
- Industrial automation and communication infrastructure equipment.
Procurement Notes
Verify component authenticity through authorized channels due to obsolete status. Confirm package integrity and moisture sensitivity level handling requirements before installation. Cross-reference datasheet specifications against current design needs as direct manufacturing support may be limited.
Selection Notes
Compare logic density and I/O count against project requirements. Evaluate thermal performance within the specified operating temperature range. Ensure compatibility with existing PCB footprint and power supply voltages. Consider end-of-life implications for long-term production stability.
Part Context
This component belongs to the Altera Stratix V GX family, designed for high-performance computing and complex logic applications. It represents a generation of FPGAs offering significant logic capacity and embedded memory within a compact ball grid array package format.
Replacement Considerations
Direct substitute: 5SGXEA3H3F35I3G. Verify pinout and electrical parameter compatibility before replacement. Consult official obsolescence notices for lifecycle management strategies.
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