— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC FPGA 696 I/O 1517FBGA
- Series:Stratix® V GX
- Mfr:Altera
- Package:Tray
- Number of LABs/CLBs:128300
- Number of Logic Elements/Cells:340000
- Total RAM Bits:19456000
- Number of I/O:696
- Voltage - Supply:0.87V ~ 0.93V
- Mounting Type:Surface Mount
- Operating Temperature:0°C ~ 85°C (TJ)
- Package / Case:1517-BBGA, FCBGA
- Supplier Device Package:1517-FBGA (40x40)
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Overview
The Altera 5SGXEA3K1F40C2WN is a Stratix V GX Field Programmable Gate Array featuring 340,000 logic elements and 696 I/Os. It utilizes a 1517-BBGA package with an operating temperature range of 0°C to 85°C. The device supports data rates up to 14.1 Gb/s via its transceivers and operates at a core voltage of 850 mV.
Feature Summary
- Supports high-speed serial communication through integrated transceivers capable of 14.1 Gb/s data rates.
- Provides extensive programmable logic capacity with 340,000 logic elements for complex digital designs.
- Features a large number of general-purpose I/Os to facilitate diverse interface connections.
Applications
- High-speed networking equipment requiring multi-gigabit serial interfaces
- Industrial automation control systems
- Telecommunications infrastructure hardware
Procurement Notes
Verify component authenticity and physical condition upon receipt. Confirm that the part matches the specified model and package type. Check for any signs of damage or moisture exposure prior to installation. Ensure compliance with relevant regulatory standards for your specific application environment.
Selection Notes
Select this model when high logic density and significant I/O count are required within a 1517-pin footprint. Consider the 14.1 Gb/s transceiver capability for serial data applications. Evaluate thermal management requirements given the surface mount package and operating temperature specifications.
Part Context
This component belongs to the Stratix V GX family, designed for high-performance applications. It offers a balance of logic resources and serial connectivity. The FBGA package allows for compact board integration while supporting high pin counts necessary for complex system-on-chip implementations.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing design files before considering alternative components from the same manufacturer series.
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