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Product Detailed Parameters
- Description:IC FPGA 840 I/O 1932FBGA
- Series:Stratix® V GX
- Mfr:Altera
- Package:Tray
- Number of LABs/CLBs:359200
- Number of Logic Elements/Cells:952000
- Total RAM Bits:53248000
- Number of I/O:840
- Voltage - Supply:0.82V ~ 0.88V
- Mounting Type:Surface Mount
- Operating Temperature:-40°C ~ 100°C (TJ)
- Package / Case:1932-BBGA, FCBGA
- Supplier Device Package:1932-FBGA, FC (45x45)
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Overview
The Altera 5SGXEABN3F45I3L is a Stratix V GX Field Programmable Gate Array (FPGA) belonging to the 5SGXA9 device family. It features 952,000 logic elements and 359,200 Adaptive Logic Modules (ALMs). The device includes 52 Mbit of embedded memory and supports up to 840 I/Os. It operates with a core voltage range of 0.82V to 0.88V and supports data rates up to 14.1 Gb/s via its transceivers. The component is housed in a 1932-ball FCBGA package and is rated for an operating temperature range of -40°C to +100°C.
Feature Summary
- High-density programmable logic architecture utilizing Adaptive Logic Modules for efficient resource utilization.
- Integrated high-speed serial transceivers supporting multi-gigabit data transmission rates.
- Extensive embedded memory resources for on-chip data buffering and processing.
- Support for complex digital designs through a large number of available input/output pins.
Applications
- High-performance networking infrastructure equipment
- Industrial automation control systems
- Test and measurement instrumentation
Procurement Notes
Verify the specific suffix 'I3L' against official Altera documentation to confirm the exact temperature grade and package variant, as suffixes define critical environmental and mechanical specifications. Confirm RoHS compliance status and moisture sensitivity level requirements prior to integration into surface-mount assembly processes.
Selection Notes
Select this model when design requirements exceed the capacity of lower-density Stratix V devices but do not necessitate the higher performance of Stratix V GT or GX variants with different transceiver counts. Ensure the 1932-ball package footprint fits within the board layout constraints and that the thermal solution can handle the power dissipation associated with 952,000 logic elements.
Part Context
This component is part of the Stratix V GX family, designed for applications requiring high bandwidth and significant logic density. It represents a generation of FPGAs optimized for cost-effective high-performance computing and connectivity solutions before subsequent Agilex architectures were introduced.
Replacement Considerations
Direct pin-to-pin replacements are generally unavailable due to architectural differences between FPGA generations. Migration typically requires redesigning the PCB and updating the Quartus Prime design files to target a newer device family such as Agilex or Stratix 10.
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