5SGXEB9R3H43I4G

Overview

The Altera 5SGXEB9R3H43I4G is a Stratix V GX Field Programmable Gate Array (FPGA) built on a 28-nm process. It features 840,000 logic elements and 317,000 adaptive logic modules (ALMs). The device includes 66 transceivers capable of data rates up to 14.1 Gb/s and provides 52 Mbit of embedded memory. It utilizes a 1760-ball FCBGA package with 600 I/Os. Operating temperatures range from -40°C to 100°C TJ, with a core supply voltage between 0.82V and 0.88V.

Feature Summary

• High-density programmable logic architecture with over 800,000 logic elements for complex digital designs.
• Integrated high-speed serial transceivers supporting multi-gigabit data transmission rates.
• Significant embedded memory capacity for on-chip data buffering and processing.

Applications

• High-performance networking infrastructure equipment
• Industrial automation control systems
• Test and measurement instrumentation

Procurement Notes

Verify the specific suffix 'I4G' against official Intel/Altera documentation to confirm temperature grade and package variant. Ensure compatibility with Quartus Prime software versions supporting the Stratix V family. Confirm moisture sensitivity level handling requirements during assembly.

Selection Notes

Select this model when requiring a balance of high logic density and moderate transceiver count within the Stratix V portfolio. Compare against the 5SGXEA series for lower cost or the 5SGXEBBR series for higher logic capacity. Validate pinout compatibility if migrating from previous generation devices.

Part Context

This component belongs to the Stratix V GX family, designed for general-purpose high-performance applications. It sits below the Stratix V GT/GS models in terms of transceiver speed but offers robust logic resources. The part represents a mature technology node suitable for stable, long-term production environments.

Replacement Considerations

Direct substitutes are limited due to specific package and suffix variations. Consider the 5SGXEB9R3H43I3LG for similar specifications with different thermal or packaging attributes. Verify functional equivalence before replacing legacy parts.