— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC FPGA 600 I/O 1152FBGA
- Series:Stratix® V GX
- Mfr:Altera
- Package:Tray
- Number of LABs/CLBs:128300
- Number of Logic Elements/Cells:340000
- Total RAM Bits:19456000
- Number of I/O:600
- Voltage - Supply:0.87V ~ 0.93V
- Mounting Type:Surface Mount
- Operating Temperature:0°C ~ 85°C (TJ)
- Package / Case:1152-BBGA, FCBGA
- Supplier Device Package:1152-FBGA (35x35)
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Overview
The Altera 5SGXMA3H1F35C2WN is a Stratix V GX Field Programmable Gate Array featuring 340,000 logic elements and 128,300 Adaptive Logic Modules. It includes 19 Mbit of embedded memory and supports up to 600 I/Os within a 1152-ball FCBGA package. The device operates at a supply voltage of 0.87V to 0.93V with a maximum data rate of 14.1 Gb/s across its transceivers.
Feature Summary
- Supports high-speed serial data transmission via integrated transceivers
- Provides extensive programmable logic capacity for complex digital designs
- Integrates significant on-chip memory resources for data buffering
Applications
- 5G Technology infrastructure
- Industrial Control systems
- Artificial Intelligence processing
- Cloud Computing hardware acceleration
- Internet of Things gateways
Procurement Notes
Verify component authenticity through authorized channels due to potential availability constraints. Confirm RoHS compliance and moisture sensitivity level requirements prior to assembly. Ensure storage conditions meet JEDDEC standards to prevent damage before reflow soldering processes are initiated.
Selection Notes
Evaluate the specific requirement for 14.1 Gb/s transceiver speeds against alternative Stratix V variants. Consider the 1152-ball package footprint constraints during PCB layout planning. Assess thermal management needs given the high logic density and power consumption characteristics inherent to this FPGA family.
Part Context
This component belongs to the Stratix V GX series, designed for high-performance applications requiring substantial parallel processing capabilities. It utilizes Intel's advanced manufacturing process to deliver high logic density within a compact form factor suitable for demanding electronic systems.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing design files when considering alternative FPGA families or updated generation devices from the manufacturer.
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