5SGXMA3K1F35C1WN

Overview

The Altera 5SGXMA3K1F35C1WN is a Stratix V GX Field Programmable Gate Array featuring 340,000 logic elements and 600 I/Os. It utilizes a 1152-BBGA FCBGA package with a 35x35 mm footprint. The device includes 19 Mbit of embedded memory and supports data rates up to 14.1 Gb/s via 36 transceivers. Operating voltage ranges from 0.82V to 0.88V, with a junction temperature range of 0°C to 85°C.

Feature Summary

• High-density logic architecture with 340,000 logic elements for complex digital processing
• Integrated high-speed serial connectivity supporting 14.1 Gb/s data transmission rates
• Significant on-chip memory capacity of 19 Mbit for efficient data buffering and storage

Applications

• High-performance telecommunications infrastructure systems
• Advanced industrial automation and control networks
• Complex signal processing and video handling applications

Procurement Notes

Verify the specific suffix 'WN' against official manufacturer documentation to confirm exact pinout and electrical characteristics. Ensure compatibility with existing PCB layouts due to the 1152-FBGA package dimensions. Confirm moisture sensitivity level requirements during storage and handling procedures prior to assembly.

Selection Notes

Select this component when requiring high logic density combined with extensive I/O capabilities in a compact form factor. Consider the Stratix V GX series for applications demanding robust high-speed serial communication interfaces. Evaluate power supply constraints regarding the 0.82V to 0.88V operating voltage range before integration.

Part Context

This part belongs to the Stratix V GX family, designed for high-end applications requiring significant system bandwidth. It represents a high-density solution within the Altera portfolio, offering advanced programmable logic resources. The series is engineered for performance efficiency in demanding electronic environments.

Replacement Considerations

Consult official cross-reference guides for compatible alternatives. Verify pin-to-pin compatibility and logical equivalence before substituting. Ensure new components meet identical thermal and electrical specifications.