5SGXMA4H2F35I3N

Overview

The Altera 5SGXMA4H2F35I3N is a Stratix V GX Field Programmable Gate Array (FPGA) manufactured by Intel. It features 420,000 logic elements and 158,500 Adaptive Logic Modules (ALMs). The device includes 37 Mbit of embedded memory and supports 552 I/Os. It operates at a core voltage of 900 mV with a data rate of 14.1 Gb/s across 24 transceivers. The component is housed in an FBGA-1152 package, suitable for surface mount installation, and functions within a temperature range of -40°C to +85°C.

Feature Summary

• Stratix V GX architecture optimized for high-speed serial communications
• Integrated hard intellectual property cores for system integration
• Supports advanced packaging technologies for dense interconnects

Applications

• High-speed networking infrastructure equipment
• Telecommunications base station processing
• Industrial automation control systems

Procurement Notes

Verify the specific suffix 'I3N' against official Intel documentation to confirm the industrial temperature grade and lead-free status. Confirm current lifecycle status as discontinued or obsolescence notices may apply. Ensure compatibility with legacy design tools if migrating existing projects.

Selection Notes

Compare total logic capacity and transceiver counts against alternative Stratix V variants like the GS series for cost optimization. Evaluate thermal requirements for the FBGA-1152 package in the target enclosure. Verify that the 14.1 Gb/s transceiver speed meets interface specifications without requiring higher-tier devices.

Part Context

This component belongs to the Stratix V GX family, designed primarily for gigabit serial applications. It shares the same silicon foundation as other 5SGXMA4 devices but differs in package, temperature rating, and specific pinout configurations defined by the suffix codes.

Replacement Considerations

Direct substitutes are limited due to the discontinued status. Consider Intel Stratix V GX models with equivalent LAB counts such as 5SGXEA4K3F35I4N, verifying pin-to-pin compatibility and electrical parameter alignment before implementation.