602-20012

Overview

The Parallax Inc. 602-20012 is a serial EEPROM memory device featuring a storage capacity of 128 kbit, organized as 16k x 8 bits. It utilizes an I2C interface for data communication and operates within a supply voltage range of 2.5 V to 6.5 V, with a typical operating voltage of 5 V. The component is housed in an 8-pin SOIC package designed for surface mount installation. It supports a maximum clock frequency of 1 MHz and maintains functionality across an industrial temperature range from -40°C to +85°C.

Feature Summary

• Supports standard I2C two-wire serial communication protocol
• Provides non-volatile data retention without power
• Compatible with standard 5V logic levels

Applications

• Data logging systems requiring persistent storage
• Configuration parameter storage in embedded controllers
• Calibration data retention for sensor modules

Procurement Notes

Verify the specific package variant (SOIC) against your PCB footprint requirements. Confirm that the I2C address configuration matches your system design, as some variants may have fixed addresses. Ensure voltage levels align with your microcontroller's I/O specifications to prevent signal integrity issues or damage during operation.

Selection Notes

Select this component when a compact, low-power serial EEPROM is required for small data sets. The I2C interface minimizes pin count usage on the host processor. Consider the 128 kbit capacity limits for application scope. Verify thermal performance if operating near the upper temperature limit of 85°C.

Part Context

This part belongs to Parallax Inc.'s EEPROM memory line, often integrated into development boards or standalone modules. It serves as a reliable non-volatile storage solution for hobbyist and industrial applications where data persistence is critical. The SOIC package facilitates automated assembly processes.

Replacement Considerations

Cross-reference tools indicate parametrically similar parts are available. Verify compatibility regarding I2C speed, voltage tolerance, and package dimensions before substitution. Ensure the replacement supports the same organizational structure (16k x 8) for direct software compatibility.