66AK2G12ABY60

66AK2G12ABY60

$34.27
  • Description:GALILEO FLIPCHIP
  • Series:66AK2G1x KeyStone II Multicore

SKU:69dea3226345 Category: Brand:

  
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Product Detailed Parameters

  • Description:GALILEO FLIPCHIP
  • Series:66AK2G1x KeyStone II Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:CAN, DMA, EBI/EMI, Ethernet, I2C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, USB
  • Clock Rate:600MHz
  • Non-Volatile Memory:External
  • On-Chip RAM:1MB
  • Voltage - I/O:1.8V, 3.3V
  • Voltage - Core:0.9V
  • Operating Temperature:0°C ~ 90°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:625-LFBGA, FCBGA
  • Supplier Device Package:625-FCBGA (21x21)
  • Grade:-
  • Qualification:-

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66AK2G12ABY60

Overview

The Texas Instruments 66AK2G12ABY60 is a multicore System-on-Chip (SoC) based on the Keystone II architecture, integrating one Arm Cortex-A15 core and one C66x DSP core. Both processors operate at up to 1000 MHz. The device features extensive error correction code (ECC) protection for L1/L2 memory and shared SRAM. It includes two PRU-ICSS subsystems, a Gigabit Ethernet MAC with IEEE 1588v2 support, and a single-lane PCIe Gen 2 interface. Memory interfaces include DDR3L EMIF supporting up to 4 GB and QSPI. The component is housed in a 625-ball FCBGA package.

Feature Summary

  • Dual-core heterogeneous architecture with Arm Cortex-A15 and C66x VLIW DSP cores operating up to 1000 MHz
  • Industrial subsystem featuring two Programmable Real-Time Unit and Industrial Communication Subsystems (PRU-ICSS)
  • Comprehensive connectivity including Gigabit Ethernet (RMII/MII/RGMII), single-lane PCIe Gen 2, and dual USB 2.0 ports
  • Robust memory subsystem with ECC protection for internal SRAM, L1/L2 caches, and external DDR3L

Applications

  • Industrial Communications and Controls
  • Home Audio Systems
  • Professional Audio Equipment
  • Protection Relays
  • Industrial Transport

Procurement Notes

Verify the specific speed grade suffix associated with the ABY60 designation against the official datasheet to confirm clock frequency capabilities. Ensure that the ordering information matches the required industrial temperature range specifications. Confirm package availability and lead times through authorized distribution channels prior to procurement planning.

Selection Notes

Select this SoC for applications requiring simultaneous real-time DSP processing and high-level OS execution. The integrated PRU-ICSS modules are suitable for deterministic control tasks. Designers must account for the 625-ball FCBGA package requirements during PCB layout. Verify power supply sequencing for the multiple voltage domains, including DVDD_DDR and DVDD18, as specified in the electrical characteristics.

Part Context

This component belongs to the 66AK2G1x family of multicore DSP+Arm KeyStone II SoCs. It shares the same architectural foundation as other devices in the series but differs in specific feature sets and performance grades. The ABY package denotes the 625-ball plastic ball grid array form factor used across several variants in this product line.

Replacement Considerations

Consult the device comparison table in the datasheet for compatible alternatives within the 66AK2G1x family. Verify pin-to-pin compatibility and feature parity before substituting with other members of the series.

66AK2G12ABY6066AK2G12ABY60
$34.27
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